After wafer dicing, the equipment performs high-speed identification, pickup and testing of millimeter-sized bare die through precision machine vision and micron-level control. It can instantly complete electrical testing and optical screening, accurately determine the performance grade and quality of each chip, and automatically sort them into corresponding carrier tapes.
This not only weeds out defective chips in advance to avoid waste of subsequent packaging costs, but also provides critical data feedback for front-end processes. Its sorting accuracy and efficiency are directly related to the final quality and production cost of chips, making it an indispensable key link for improving the yield and efficiency of semiconductor manufacturing.