Semiconductor high-speed die bonding machine bonding head module-Demart Intelligent

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Semiconductor high-speed die bonding machine bonding head module

高速度，高加速度，高定位精度，结构紧凑，体积小，无齿槽力。

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固晶机邦定头模组让您生产更高效。结构紧凑、体积小；无齿槽力，定位精度高，重复精度±1.5μm；高动态响应，Y轴速度能达到2.3m/s，加速度能达到1.3g；内置冷却系统，极大提高的电机持续推力输出，运行更稳定。

应用场合：应用与芯片贴装设备。

半导体高速固晶机邦定头模组

Alignment correction platform

Alignment correction platform

Semiconductor high-speed die bonding machine bonding head module

Semiconductor high-speed die bonding machine bonding head module

AOI Visual Inspection Platform

AOI Visual Inspection Platform

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