Laser cutting marble platform, gantry dual drive structure, three-axis operation, ironless linear motor configuration, zero magnetic resistance, smooth operation, ultra-high dynamic response; High precision, with three-axis repeatability achieved±two point fiveμmAluminum beam design, high acceleration, maximum acceleration up to2GIt can be used for high-precision laser cutting processing requirements such as semiconductor wafer slicing, LCD screen cutting, and silicon chip laser cutting.
