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die bonder

Demart direct drive platforms and linear motors, with their proprietary direct drive technology, completely eliminate the complex transmission structure of traditional rotary motors combined with lead screws.

Core Advantages:

  • Elevated Precision: Nanometer-level positioning accuracy ensures flawless chip mounting.

  • Doubled Speed: Ultra-fast dynamic response breaks through production capacity bottlenecks significantly.

  • Stable & Reliable: Contact-free and wear-free drive mode reduces failure rates and maintenance costs remarkably.

We provide a solid and agile motion control core for high-end semiconductor packaging. Empowered by direct drive technology, your production becomes more precise, more efficient and more reliable.

Choose Demart, choose the next generation of productivity.

Solution Details

Semiconductor die bonders are core equipment in semiconductor packaging, with the key process of accurately mounting chips onto designated positions of substrates or lead frames.

The core process consists of three steps: 1. Loading: Chips and substrates are fed into the equipment via special trays and carriers respectively. 2. Visual positioning: The visual positioning system identifies chip pins and substrate pads to calibrate positional deviations. 3. Mounting and fixing: A suction nozzle picks up the chip, transfers it to the target position, and secures it through solder paste welding or conductive adhesive bonding.

Its key features are as follows: the process precision directly affects the electrical performance and reliability of semiconductor devices. It is compatible with chips of different sizes and widely used in packaging scenarios such as LEDs and integrated circuits.

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