Wafer thinning machine-Demart Intelligent

Wafer thinning machine

Demart direct drive motors stand out as a premier core power choice for wafer thinning machines, thanks to their exceptional speed and precision stability. Abandoning the backlash and friction inherent in traditional transmission mechanisms, they achieve micron-level precise positioning, enabling nanometer-level thickness tolerance control during the thinning process and perfectly meeting the precision processing requirements of wafers for advanced manufacturing processes.

Boasting high rigidity and fast response performance, they ensure cutting stability during thinning, effectively reducing defects such as wafer edge chipping and cracks and significantly improving production yield. The low-noise, low-vibration design combined with long-lasting durability lowers equipment operation and maintenance costs and extends continuous running time.

Demart offers a complete set of hardware and software direct drive solutions, infusing high efficiency and high precision into wafer thinning machines. It helps the semiconductor manufacturing industry break through process bottlenecks and empowers the steady advancement of the industry toward smaller sizes and higher integration.

Solution Details

The core principle of a wafer thinning machine is to remove the excess silicon layer from the back of the wafer through precision grinding, polishing and other processes, reducing its thickness from several hundred micrometers to a specific specification (usually 10-200μm) to meet the requirements of packaging, heat dissipation and integration. It relies on a high-precision spindle and feed system, combined with online thickness detection and closed-loop control, to ensure thinning uniformity.

In terms of characteristics, first, it features nanometer-level thickness control accuracy with a tolerance controllable within ±1μm. Second, it adopts a rigid structure and shock absorption design to reduce processing defects and ensure a high yield rate. Third, it is compatible with wafers of different sizes and supports automatic loading and unloading as well as process traceability to improve production efficiency. At the same time, it incorporates a clean and eco-friendly design that meets the cleanliness requirements of semiconductor workshops, providing critical support for the manufacturing of semiconductors with advanced processes.

Wafer thinning machineRelated Demart products

More +

air-bearing turntable

More +

Axial magnetic field motor