Diamond Dicing: A Classic and Efficient Choice for Semiconductor Dicing

Diamond dicing has become a core dicing solution for semiconductor mass production by virtue of its high-rigidity cutting technology. It features a high-speed rotating diamond blade as the core component, paired with a precision feed system to achieve precise wafer separation, and is compatible with wafers of various materials.

It boasts outstanding cutting efficiency, supporting batch processing of large-size wafers, with thickness tolerance controlled at the micron level to effectively ensure chip integrity. It delivers stable process repeatability, reducing defects such as edge chipping and cracks and helping to improve production yield. With a mature structure and convenient operation and maintenance, it seamlessly integrates with automated production lines. From consumer electronics to power device fields, it has always been a cost-effective dicing solution that balances efficiency and cost.

Laser Dicing: A Precision Dicing Innovation for Advanced Manufacturing Processes

Laser dicing overcomes the challenges of dicing ultra-thin and fragile wafers with its non-contact processing advantage. It utilizes the thermal effect or cold processing technology of a focused laser beam to achieve mechanical stress-free cutting, perfectly meeting the ultra-fine pitch dicing requirements in advanced manufacturing processes.

Its cutting precision reaches the nanometer level with a straight and error-free cutting path, capable of processing ultra-thin wafers with a thickness of less than 10μm and greatly reducing the risk of chip damage. Free from dust pollution and tool wear, it meets the requirements of clean rooms. Meanwhile, it supports complex pattern cutting and is suitable for the processing of special-shaped chips. From high-end semiconductors to the Mini/Micro LED field, it provides an efficient solution for high-integration and high-precision dicing needs, empowering the technological upgrading of the industry.