As a critical step in semiconductor manufacturing, semiconductor wafer cleaning equipment is engineered specifically for the surface cleanliness of wafers. It efficiently removes particles, metal ions, photoresist and organic contaminants left during the manufacturing process, eliminating defect risks from the source.

Integrating diverse processes such as wet cleaning and dry cleaning, it is compatible with wafers of different specifications from 2 to 12 inches and adapts to the characteristics of various materials including silicon and silicon carbide. Equipped with precision spray, ultrasonic oscillation and plasma purification technologies, it achieves micron-level dead-angle-free cleaning with a contaminant removal rate of over 99.9% without damaging the wafer thin films and circuit structures.

Featuring fully automated operation capabilities, it supports batch continuous processing and is paired with a closed-loop monitoring system to ensure consistent cleaning for every wafer. The low-consumption and eco-friendly design reduces reagent waste, aligning with green production standards, while its compact layout is suitable for the requirements of clean rooms.

From mature manufacturing processes to advanced technologies, the equipment leverages its core advantages of precise decontamination, safe wafer protection and high-efficiency adaptability to lay a solid clean foundation for wafer processing, strongly supporting the improvement of chip yield and reliability.