I. Wire Bonding Process Flow

Wafer Loading and Positioning: Fix the chip and lead frame/substrate on the workbench, and precisely align the bonding pads via a vision system.Wire Threading: Pass metal wires (gold, aluminum, etc.) through the bonding tool and deliver them above the chip bonding pads.Bonding Connection: The tool applies pressure and cooperates with thermal/ultrasonic energy to form a metallurgical bond between the wire and the chip bonding pad (the first bond point).Wire Forming: The tool moves to pull the wire, forms it along a preset path, and completes the second bond point on the substrate/frame bonding pad.Wire Cutting and Inspection: Cut the wire, inspect the bonding quality, and proceed to the next cycle if qualified.

II. Principle and Characteristics of Wire Bonder

Principle: Drive the bonding tool through a mechanical transmission system, and combine thermal, ultrasonic or pressure energy to realize atomic diffusion between the metal wire and the pad surface, forming a stable metallurgical bond to achieve electrical interconnection between the chip and the external circuit.Characteristics: High positioning accuracy with a repeat positioning error of ≤±1μm, suitable for micro-nano level bonding pads. Fast bonding speed, with high-end models achieving several bonds per second to meet mass production demands. Strong compatibility, supporting multi-material wires, different chip sizes and packaging forms. Equipped with a vision inspection and quality monitoring system to screen out defective products in real time. Low vibration and low noise during operation, with a stable structure to ensure long-term reliable work.