In semiconductor production, wafer and chip inspection acts as an irreplaceable quality gatekeeper throughout the entire process, directly determining product yield, reliability and market competitiveness, and its importance is irreplaceable.

As the basic carrier of chip manufacturing, wafers are prone to micro-nano scale defects caused by environmental impurities and process deviations from epitaxial growth to lithography, etching and other processes. Precise inspection can screen out unqualified wafers in a timely manner, avoid the waste of high-cost subsequent processing, and at the same time feed back the direction of process optimization to reduce the overall production cost.

After chip packaging, it is necessary to verify the functional integrity through the detection of electrical performance, reliability and other aspects. Semiconductors are applied in key fields such as automotive electronics and aerospace. Tiny flaws in chips may lead to equipment failures and even trigger safety risks. The inspection link can effectively avoid such hidden dangers and ensure the stable operation of end products.

In addition, as chip manufacturing processes advance to 3nm, 2nm and below, micro-nano structures have increasingly stringent precision requirements. The upgrading and strict implementation of inspection technologies are the core support for promoting the development of the semiconductor industry towards high-end and high reliability, and also the key for enterprises to seize market share and build technical barriers.